To prevent bending of leads and shorten the mounting time of components by covering, with a copper foil, part of an upper and a bottom face of a printed wiring board near a plurality of component-mounting holes and inner faces of the holes, and forming the mounting holes in such a shape that the longitudinal diameter is larger than the lateral diameter.

Part of an upper and a bottom face of a double-sided printed wiring board 1 near a plurality of component-mounting holes 2 and inner faces of the mounting holes 2 are covered with a copper foil 3. The component- mounting holes 2 are formed with the diameter in the longitudinal direction which is larger than the diameter in the lateral direction by a specified magnification M and, substantially, the mounting holes 2 are formed in an elliptical shape in top view. Therefore, when fixing components having a plurality of leads on these mounting holes 2 by soldering, the components can be easily mounted even if the leads lack uniformity since the mounting holes 2 have margins in the lead bending direction.