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Patent Searching and Data


Title:
PRINTED WIRING SUBSTRATE UNIT AND REFORMING PART FOR THE SUBSTRATE
Document Type and Number:
Japanese Patent JP2007027793
Kind Code:
A
Abstract:

To provide a printed wiring substrate in which electrical connections to electronic components can be securely established.

A reforming part 27a is attached to the printed wiring substrate 26. The reforming part 27a is provided with: two fulcrums 31 that contact one surface of the printed wiring substrate 26; and contact points 33, 34 that are located between the fulcrums 31 and contact the printed wiring substrate 26 caved from the flat plane 32 containing the two fulcrums 31. Screws 28 mutually connects the printed wiring substrate 26 and the reforming part 27a deforming the printed wiring substrate 26. The printed wiring substrate 26 is drawn toward the reforming part 27a, resulting in establishing a flat plane on the front side of the printed wiring substrate 26.


Inventors:
MORITA YOSHIHIRO
Application Number:
JP2006282048A
Publication Date:
February 01, 2007
Filing Date:
October 16, 2006
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H05K1/02
Attorney, Agent or Firm:
山▲崎▼ 薫