PURPOSE: To provide a probe, which is capable of corresponding fully to the test of the product of an integrated electronic circuit brought into the state of high density.
CONSTITUTION: Comb pieces 3 are formed on one side of a thin plate 2 consisting of a flexible insulating material by cutting slits 3' at a pitch to correspond to the arrangement pitch between terminals to be inspected. Then, a measuring terminal 4 is subjected to conductor patterning and is formed on the point part of each comb piece 3 by a photolithography method and a connector electrode 6, which is provided at an arbitrary position on the thin plate 2 to each measuring terminal 4, such as at an opposite position to the measuring terminal 4, and leads 5 for coupling the terminals 4 with the connector electrodes 6 are subjected to conductor patterning and are formed by a photolithography method.
IGETA SHINICHI
SAWADA NORITATSU
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