Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP7211751
Kind Code:
B2
Abstract:
A substrate processing apparatus that includes a substrate holder, a cup member, an elevating mechanism, a first nozzle, and a camera. The substrate holder holds a substrate and rotates the substrate. The cup member surrounds the outer circumference of the substrate holder. The elevating mechanism moves up the cup member so that the upper end portion of the cup member is located at the upper end position higher than the substrate held by the substrate holder. The first nozzle has a discharge port at a position lower than the upper end position, and discharges first processing liquid from the discharge port to an end portion of the substrate. The camera images an imaging region that includes the first processing liquid discharged from the discharge port of the first nozzle and is viewed from an imaging position above the substrate.
Inventors:
Eiji Karihara
Yuji Okita
Hiroaki Kakuma
Tatsuya Masui
Yuji Okita
Hiroaki Kakuma
Tatsuya Masui
Application Number:
JP2018189980A
Publication Date:
January 24, 2023
Filing Date:
October 05, 2018
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; B05C11/00; B05C11/08; B05C11/10; B05D1/40; B05D3/00; B05D3/10
Domestic Patent References:
| JP2012009812A | ||||
| JP2015152475A | ||||
| JP2011181588A | ||||
| JP2016136572A |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita