Title:
PROBER APPARATUS
Document Type and Number:
Japanese Patent JPH01171236
Kind Code:
A
Abstract:
PURPOSE:To ensure contact between a plurality of probes and a wafer to be tested, by giving suttle supersonic vibration to the wafer to be tested, detecting the vibration by means of pickups mounted on the probes and obtaining a logical product of a plurality of outputs detected by the probes by means of an AND circuit. CONSTITUTION:A supersonic oscillator 4 is actuated and a supersonic vibrator 3 is excited to give suttle supersonic vibration to a wafer to be tested 1. A pair of probes 5, 6 are put close to pads on the wafer 1. When the probe 5 is contacted with the wafer 1, the supersonic vibration of the wafer 1 is transmitted to the probes 5, 6. The supersonic vibration is converted into electrical signals by supersonic pickups 7, 8, and amplified so that detecting circuits 9, 10 detect supersonic vibration on the probes. Logical product of the outputs from the detecting circuits 9 and 10 is obtained by an AND circuit 11. Output from the AND circuit 11 is obtained when both the probes 5 and 6 are contacted with the wafer 1. Accordingly, nondefective wafers 1 can be selected correctly by operating a measuring device only when output is obtained from the AND circuit 11.
Inventors:
KIYONO MIKIO
Application Number:
JP32829187A
Publication Date:
July 06, 1989
Filing Date:
December 26, 1987
Export Citation:
Assignee:
NEC CORP
International Classes:
G01R1/067; G01R31/28; H01L21/66; G01R31/26; (IPC1-7): G01R31/26; G01R31/28; H01L21/66
Attorney, Agent or Firm:
Umeo Yamauchi