Title:
プローバ及びプローブ検査方法
Document Type and Number:
Japanese Patent JP7352812
Kind Code:
B2
Abstract:
To provide a prober capable of realizing good contact between the electrode pad on a wafer and a probe, without providing shutter means in the wafer chuck, and to provide a probe inspection method.SOLUTION: A prober 10 employing a vacuum suction system for holding a wafer chuck 34 to the probe card 32 side includes suction control means for starting suction operation of an internal space by a vacuum electro-pneumatic regulator 54, before the internal space formed between the wafer chuck 34 and the probe card 32 is brought into sealed state by a ring-shaped seal member 48, when the wafer chuck 34 is moved toward the probe card 32 by a Z-axis movement/rotation part 72.SELECTED DRAWING: Figure 4
Inventors:
Hideaki Nagashima
Application Number:
JP2022045757A
Publication Date:
September 29, 2023
Filing Date:
March 22, 2022
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/66
Domestic Patent References:
| JP2000164647A |
Attorney, Agent or Firm:
Kenzo Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura