Title:
少なくとも2つのレーザパルスの組によるメモリリンクの処理
Document Type and Number:
Japanese Patent JP2005512814
Kind Code:
A
Abstract:
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 500 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single "pulse" by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
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Inventors:
Yunlong Sun
Edward Jay Swenson
Richard S Harris
Edward Jay Swenson
Richard S Harris
Application Number:
JP2003553680A
Publication Date:
May 12, 2005
Filing Date:
December 17, 2002
Export Citation:
Assignee:
Electro Scientific Industries, Inc.
International Classes:
B23K26/361; B23K26/067; B23K26/351; H01L21/82; H01L21/8242; H01L23/525; H01L27/10; H01L27/108; H01S3/00; B23K101/38; G11C17/14; (IPC1-7): B23K26/00; H01L21/82; H01L21/8242; H01L27/10; H01L27/108
Attorney, Agent or Firm:
Kosaku Sugimura