Title:
加工方法
Document Type and Number:
Japanese Patent JP6912254
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To process a processed material when dividing a plate-like processed material to be formed without generating a clog in a cutting blade, and using a laser processing device.SOLUTION: A processing method is for forming chips by parting a processed material W in which a film W2 is formed on a back surface W1a of a plate-like material W1, and a partition schedule line S to be crossed is set on a front surface W1a along the partition schedule line S. The processing method includes: a step of forming a groove M1 having a cross-section V shape along the partition schedule line S from the front surface W1a of the processed material W by a dry etching; a step of adhering an expand sheet T1 onto the back surface W2b of the processed material W before or after the execution of the step of forming the groove; an expansion step of applying an outer force to the film W2 along the groove M1 while expanding the sheet T1 after the execution of the step of adhering the expand sheet and the step of forming the groove; and a step of pick-upping the chips from the sheet T1 after the execution of the expand step.SELECTED DRAWING: Figure 7
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Inventors:
Michael william gud
Application Number:
JP2017075105A
Publication Date:
August 04, 2021
Filing Date:
April 05, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; H01L21/3065
Domestic Patent References:
| JP2016207921A | ||||
| JP2011035245A | ||||
| JP2017041525A | ||||
| JP2009253071A | ||||
| JP2013179317A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office