Title:
保護カバー部材及び部材供給用シート
Document Type and Number:
Japanese Patent JP7247419
Kind Code:
B2
Abstract:
A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×105 Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.
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Inventors:
Yuki Kigami
Kenji Onishi
Kenji Onishi
Application Number:
JP2022512286A
Publication Date:
March 28, 2023
Filing Date:
August 05, 2021
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/38; C09J133/14; C09J201/00
Domestic Patent References:
| JP2007081881A | ||||
| JP2012229372A | ||||
| JP2017139408A | ||||
| JP2019209689A | ||||
| JP2011135042A | ||||
| JP2002249737A | ||||
| JP8148815A | ||||
| JP63312379A | ||||
| JP7076672A | ||||
| JP2010000464A | ||||
| JP2012253481A |
Foreign References:
| WO2015152010A1 | ||||
| WO2019089021A1 |
Attorney, Agent or Firm:
Koichi Kamata