Title:
RADIATION SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE COMPOSITION
Document Type and Number:
Japanese Patent JPH08272099
Kind Code:
A
Abstract:
PURPOSE: To provide a radiation sensitive resin compsn. having high sensitivity to radiation and to form a high resolution pattern.
CONSTITUTION: This radiation sensitive resin compsn. contains a 1st alkali- soluble resin, a 2nd alkali-soluble resin having alkenyl ether groups and an acid generating agent which generates an acid when irradiated. The top of a substrate is coated with this radiation sensitive resin compsn. to form a coating film, this coating film is heated after selective irradiation and the objective pattern is formed by developing the coating film.
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Inventors:
ITO TOSHIO
Application Number:
JP7495995A
Publication Date:
October 18, 1996
Filing Date:
March 31, 1995
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
G03F7/004; G03F7/038; G03F7/38; H05K3/06; (IPC1-7): G03F7/038; G03F7/004; G03F7/38; H05K3/06
Attorney, Agent or Firm:
船橋 國則