Title:
RADIATOR
Document Type and Number:
Japanese Patent JP2002026201
Kind Code:
A
Abstract:
To provide a radiator which can mount an electronic component like a semiconductor device which generates heat largely.
Radiating fins 3 are bonded on a thick-walled pedestal part 2 of a board 1 manufactured by forging or the like. The radiating fins 3 are formed by working a metal thin plate composed of aluminum or the like or by hollow extrusion working of aluminum, aluminum alloy, copper, copper alloy, etc. Thereby the number and the height of the fins can be increased as compared with the case wherein radiating fins constituted of a solid extrusion material are used, and a radiator excellent in efficiency can be obtained.
Inventors:
KOBAYASHI MASAYUKI
Application Number:
JP2000210846A
Publication Date:
January 25, 2002
Filing Date:
July 12, 2000
Export Citation:
Assignee:
KOBAYASHI MASAYUKI
International Classes:
H01L23/36; (IPC1-7): H01L23/36
Attorney, Agent or Firm:
Wataru Ogura
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