To provide the forming method of a heat dissipation member for an electronic component, which can properly process the planarity of a metal, plate if the plate thickness of the metal plate is of comparatively thick.

This method is a method for forming a heat dissipation member 1, which is bonded to a package body 100, is protuberantly formed with a projected stand part 2 for providing an electronic component S on the side of the surface on one side of its surfaces and consists of a metal having thermal conductivity, and the member 1 is formed by the method, where a recessed place 3 of a dimension shallower than the plate thickness of a metal plate 10 is formed pressingly by a press or the like from the side of the surface on one side of the surfaces of the plate 10 and at the same time, the metal of the recessed plate 3 is made to transfer to the side of the other surface of the plate 10 to protuberantly form the projected stand part 2, and thereafter, the side of the surface on one side of the plate 10 is cut until the side of the surface on one side reaches the bottom of the plate 3 to form the surface of the plate 10 into a flat surface.