Title:
冷却構造
Document Type and Number:
Japanese Patent JP7338555
Kind Code:
B2
Abstract:
To ensure a tightening margin at low resilience, while at the same time improving a heat transfer performance.SOLUTION: A cooling structure 93 has: a heating part 20; a heat radiation part 40 which is at a lower temperature than that of the heating part 20; and heat transfer bodies 30 which are interposed in a gap "g" between the heating part 20 and the heat radiation part 40. Each of the heat transfer bodies 30 is provided with a plurality of fins 36 which is aligned in an alignment direction Y. Between the heating part 20 and the heat radiation part 40, the plurality of heat transfer bodies 30 is interposed in an overlapping manner. Thus, viewing in a direction X perpendicular to the alignment direction Y, the fins 36 of one of the heat transfer bodies 30 are disposed between the fins 36 of another one of the heat transfer bodies 30. The heat of the heating part 20 is transferred to the heat radiation part 40 by each of the fins 36 of each of the heat transfer bodies 30.SELECTED DRAWING: Figure 2
Inventors:
Kaoru Kaoru
Yuichi Handa
Yuichi Handa
Application Number:
JP2020088276A
Publication Date:
September 05, 2023
Filing Date:
May 20, 2020
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/36; G01R31/26
Domestic Patent References:
| JP2009146948A | ||||
| JP7142647A | ||||
| JP10260230A |
Foreign References:
| WO2011021384A1 |
Attorney, Agent or Firm:
Tsuyoshi Yamada
Kyoko Hino
Hiroshi Matsuda
Yusuke Kita
Kyoko Hino
Hiroshi Matsuda
Yusuke Kita
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