Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2002026196
Kind Code:
A
Abstract:
To provide a semiconductor package modified, so as to efficiently enable temperature rise of the semiconductor package.
A semiconductor package is provided with projections 2 having triangular sections or grooves which are provided in the surface of the package.
Inventors:
YOSHIDA AKIRA
Application Number:
JP2000212319A
Publication Date:
January 25, 2002
Filing Date:
July 13, 2000
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L23/28; H01L23/29; (IPC1-7): H01L23/28; H01L23/29
Attorney, Agent or Firm:
Fukami Hisaro