Title:
RESIN-SEALED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2002026195
Kind Code:
A
Abstract:
To provide a semiconductor device which can apply proper soldering on the terminals of a resin-sealed semiconductor device while preventing resin burrs from being generated on the peripheries of the terminals of the device constituted using a lead frame.
In a semiconductor device of a structure, a semiconductor chip 6 and lead terminals 3 and 4 are sealed with a resin 5, and the lower surfaces of the terminals 3 and 4 are flush with the lower surface of the resin 5. Recessed parts 5a are respectively provided in the boundary parts between the terminals 3 and 4 and the resin 5. The recessed parts are formed into a tapered shape or a circular-arc shape.
Inventors:
UMEMOTO HIDETOSHI
IWAHARA MITSUMASA
IWAHARA MITSUMASA
Application Number:
JP2000210118A
Publication Date:
January 25, 2002
Filing Date:
July 11, 2000
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L23/28; H01L21/56; H01L23/48; (IPC1-7): H01L23/28; H01L21/56
Attorney, Agent or Firm:
Shoji Shinobe