Title:
REDUCTION PROJECTION ALIGNER
Document Type and Number:
Japanese Patent JPH05275304
Kind Code:
A
Abstract:
PURPOSE: To make it possible to form identification information on a wafer without producing a particle while reducing the number of steps in the fabrication process of semiconductor.
CONSTITUTION: A conveyor 18 conveys a second reticle 4 to a position where the second reticle 4 is superposed on a first reticle 2 mounted on a reticle stage 16. An original pattern is formed on the first reticle 2 while a bar code is formed on the second reticle 4. When the original pattern is transferred to a final transfer region on a wafer 8, the conveyor 18 is operated and light is projected from a light source 12 thus transferring the original pattern and the bar code to photoresist on the wafer 8.
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Inventors:
Yuichi Egawa
Yoshinori Okawa
Yoshinori Okawa
Application Number:
JP10222892A
Publication Date:
October 22, 1993
Filing Date:
March 27, 1992
Export Citation:
Assignee:
Nippon Steel Corporation
International Classes:
G03F7/20; H01L21/027; H01L21/30; (IPC1-7): H01L21/027; G03F7/20
Attorney, Agent or Firm:
Masao Handa
Previous Patent: JPS5275303
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