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Patent Searching and Data


Title:
RESIN BODY
Document Type and Number:
Japanese Patent JPH05255592
Kind Code:
A
Abstract:

PURPOSE: To obtain a resin body with improved toughness by incorporating a reactive modifier into a thermoplastic resin component containing a cyanate ester and/or a maleimide thermosetting resin and a polyarylsulfone or polyimide.

CONSTITUTION: A resin body comprises 1-98 wt.% of a thermosetting resin selected from composition A, 1-98 wt.% of a thermosetting resin selected from either or both of composition B and composition C, 1-98 wt.% of a reactive modifier, 0-5 wt.% of a catalyst, and 0-5 wt.% of a radical quencher, wherein the thermosetting resins comprise a di/polyisocyanate ester and/or maleimide and/or an oligomer and/or combinations of them, composition A comprises a cyanate ester of formula I, composition B comprises a polyimide of formula II, and composition C is a polyarylsulfone comprising repeating units of ether and/or thioether bonds, formula II, formula IV and/or Pha, in which Ph represents phenylene and (a) represents about 0-2.


Inventors:
Paul D. Mackenzie
Biney Malhotra
Application Number:
JP32405091A
Publication Date:
October 05, 1993
Filing Date:
November 13, 1991
Export Citation:
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Assignee:
ICI Composites Incorporated
International Classes:
C08G73/00; C08G73/12; C08K5/21; C08K5/3415; C08L79/08; C08L81/06; C08L63/00; (IPC1-7): C08L79/08; C08K5/21; C08K5/3415
Attorney, Agent or Firm:
Aoki Akira (3 outside)