Title:
RESIN COMPOSITION AND MULTILAYER STRUCTURE MATERIAL
Document Type and Number:
Japanese Patent JPH04202549
Kind Code:
A
Abstract:
PURPOSE:To obtain a composition giving a hot-drawn multilayer structure material free from pinhole and crack and having remarkably improved formability without deteriorating the transparency and gas-barrierness by compounding a polyamide to a specific ethylene-vinyl alcohol copolymer composition. CONSTITUTION:The objective composition is produced by compounding 0.5-4.5 pts.wt. of a polyamide to 100 pts.wt. of an ethylene-vinyl alcohol copolymer composition containing (A) 40-95wt.% of an ethylene-vinyl alcohol copolymer having an ethylene content of 20-60mol% and (B) 5-60wt.% of an ethylene-vinyl alcohol copolymer having an ethylene content of 25-65mol% provided that the ethylene content of the component B is higher than that of the component A by >=5mol%. A laminated structure material useful for food-packaging container, flavor-retaining container, etc., can be produced by forming a layer of a thermoplastic resin [preferably drawable at a hot-drawing temperature between Tm-110 deg.C and Tm-10 deg.C (Tm is melting point of the component A)] on at least a surface of a layer composed of the above composition.
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Inventors:
NEGI TAICHI
HIROFUJI SATOSHI
HIROFUJI SATOSHI
Application Number:
JP33736190A
Publication Date:
July 23, 1992
Filing Date:
November 30, 1990
Export Citation:
Assignee:
KURARAY CO
International Classes:
B32B27/28; B29C55/02; C08J5/18; C08L23/08; C08L23/26; C08L29/04; C08L77/00; B29K23/00; B29K29/00; B29K77/00; B29L9/00; (IPC1-7): B32B27/28; C08L23/26; C08L29/04