Title:
ミリ波基板用樹脂組成物、ミリ波基板用接着フィルム、ミリ波基板、ミリ波レーダー基板および半導体装置
Document Type and Number:
Japanese Patent JP7364243
Kind Code:
B2
Abstract:
The present invention provides a resin composition that is for a millimeter-wave substrate, that provides a cured product having excellent high-frequency characteristics, a small temperature dependence of tanδ, and superior flame retardance, and that can be used as an insulator for a millimeter-wave radar. The resin composition for a millimeter-wave substrate contains a hydrogenated styrene-based elastomer (A), a cross-linkable compound (B) having a biphenyl backbone, and a flame retardant (C) containing a metal salt of phosphinic acid, and is characterized in that: component (C) accounts for 15-50 parts by mass with respect to a total of 100 parts by mass of component (A), component (B), and component (C); and the rate of change of dielectric tangent of a cured product of said resin composition at 10 GHz at 120°C is at most 30% with respect to that at 25°C.
Inventors:
Tsuyoshi Kurokawa
Masaki Yoshida
Junya Sato
Masaki Yoshida
Junya Sato
Application Number:
JP2020559195A
Publication Date:
October 18, 2023
Filing Date:
December 02, 2019
Export Citation:
Assignee:
NAMICS Corporation
International Classes:
H05K1/03; C08K5/5313; C08L53/02
Domestic Patent References:
| JP2018090664A | ||||
| JP2014034668A | ||||
| JP2014168045A |
Foreign References:
| WO2008018483A1 | ||||
| WO2018097010A1 |
Attorney, Agent or Firm:
IAT Patent Attorney Corporation
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