Title:
電子部品の樹脂封止成形装置
Document Type and Number:
Japanese Patent JP5215886
Kind Code:
B2
Inventors:
Yohei Onishi
Application Number:
JP2009015086A
Publication Date:
June 19, 2013
Filing Date:
January 27, 2009
Export Citation:
Assignee:
towa corporation
International Classes:
B29C45/02; B29C45/26; B29C45/80; H01L21/56
Domestic Patent References:
| JP2008277470A | ||||
| JP5111931A | ||||
| JP5267374A | ||||
| JP6260518A | ||||
| JP4361537A | ||||
| JP2002217222A | ||||
| JP2000043108A | ||||
| JP2010165938A | ||||
| JP2006321115A |
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