Title:
ROTATORY TREATMENT DEVICE
Document Type and Number:
Japanese Patent JPS5216172
Kind Code:
A
Abstract:
PURPOSE:In the rotary treatment device for the semiconductor wafer, by providing a chuck which lays the treated surface facing downward so that dust will not stick on the treated surface, to make the highly accurate treatment possible.
Inventors:
KAGEYAMA NAGAICHIROU
ANSAI NORIO
SHIRASU TATSUMI
ANSAI NORIO
SHIRASU TATSUMI
Application Number:
JP9188175A
Publication Date:
February 07, 1977
Filing Date:
July 30, 1975
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/30; H01L21/027; H01L21/302; (IPC1-7): H01L21/302