To provide a sealing resin composition having extremely low dielectric constant and excellent also in moldability and moisture resistance and to provide a resin-sealed type semiconductor device by using the resin composition.

The sealing resin composition comprises (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator and (D) inorganic foam particles as essential components and the component D, preferably foamed silica, is contained in a ratio of 10-90 wt.%. The resin-sealed type semiconductor device is obtained by sealing a semiconductor device with the cured resin.