To provide a seamless pipe manufacturing method in which a seamless pipe manufactured on a surface of a die can be easily separated from the die, and an electrocasting die used therefor, and to provide a seamless pipe manufacturing method in which a seamless pipe can be mass-produced at a low cost, and an electrocasting die used therefor.

Electroplating is performed in a condition in which the die temperature is kept higher than the electroplating temperature, the die is cooled after forming an electroplating film, and the electroplating film is separated from the die. After the electroplating film is formed on a surface of the electrocasting die with a plurality of dies connected thereto, the dies are disconnected, and the electroplating film formed on each die is separated.