To provide a semiconductor chip mounting flexible printed board and a semiconductor chip assembly structure, where the inner lead of an electrode formed of metal foil is hardly separated from the electrode of a semiconductor chip even if a temperature change occurs, and a joint between the inner lead and the electrode of the semiconductor chip can be protected against electrolytic corrosion contamination.

A flexible printed board 10 is composed of a flexible polyimide insulating film 12 and an aluminum foil inner lead terminal 11 formed on the one surface of the film 12. A horseshoe notch 13 is provided in the polyimide film 12 surrounding the tip of the inner lead terminal 11. The inner lead terminal 11 and the polyimide film 12 located in the notch 13 located in the notch 13 are bent toward the connection pad 2 of a semiconductor chip 1, by which the inner lead terminal 11 is connected to the connection pad 2.