To provide a semiconductor chip packaging body manufacturing method which can perform highly accurate electrode bonding and reduce failure of electrode bonding.
A semiconductor chip packaging body manufacturing method comprises a process of pressing a semiconductor chip and an electronic component via an encapsulation resin 5 with heating the semiconductor chip and the electronic component at different temperatures to contact and bond bump electrodes 2 of the semiconductor chip with an electrode part of the electronic component, and a process of curing the encapsulation resin 5. In the process of contacting and bonding the bump electrodes 2 of the semiconductor chip with the electrode part of the electronic component, when it is assumed that a melt point of a tip portion of the bump electrode 2 of the semiconductor chip is M1, a melt point of the electrode part of the electronic component is M2, a temperature for heating the semiconductor chip is T1 and a temperature for heating the electronic component is T2, the following formula is satisfied: T1<M1<T2<M2 or T2<M2<T1<M1.
HATAI MUNEHIRO
TAKEDA KOHEI
| JP2010267741A | 2010-11-25 | |||
| JP2006054360A | 2006-02-23 |