To properly ensure electrical insulation between a semiconductor device and a cooling member without applying a special treatment or installing additional components between the semiconductor device and the cooling member when mounting the half-mold package type semiconductor device on the cooling member.
The semiconductor device 100 comprises a heatsink 10, a semiconductor element 20 mounted on one surface 10a of the heatsink 10, and a molding resin 50 which seals the heatsink 10 and the semiconductor element 20 so as to encapsulate them while exposing the other surface 10b of the heatsink 10 to the outside. On the other surface 10b side of the heatsink 10, the other surface 10b of the heatsink 10 recedes more than the surface 51 of the molding resin 50, causing the other surface 10b of the heatsink 10 to be located away from the cooling member 200.
HIRAO YASUNOBU
Takahiro Miura
Fumihiro Mizuno