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Title:
PACKAGING STRUCTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2005327790
Kind Code:
A
Abstract:

To improve the assembling workability and reduce a cost by eliminating a seal member between an installation member and a radiation fin in a packaging structure of a semiconductor device wherein the semiconductor device is assembled into the radiation fin installed on the installation member.

In the packaging structure of the semiconductor device wherein the semiconductor device 10 is assembled into the radiation fin 30 installed on the installation member 20, the radiation fin 30 is integrally formed with the installation member 20 with installation portions 31 with respect to the installation member 20 being embedded in the installation member 20.


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Inventors:
YAMADA MASAO
Application Number:
JP2004142276A
Publication Date:
November 24, 2005
Filing Date:
May 12, 2004
Export Citation:
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Assignee:
DENSO CORP
International Classes:
H01L23/40; (IPC1-7): H01L23/40
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno



 
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