Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE OF CARRIER TAPE USED THEREFOR
Document Type and Number:
Japanese Patent JPH06268013
Kind Code:
A
Abstract:
PURPOSE: To provide a carrier tape which prevents oxide from depositing on a bonding tool and thus prevents the degradation of bonding strength.
CONSTITUTION: A semiconductor device has a structure in which a TAB pellet 1 with gold bumps 2 is attached to a wiring circuit 4 of copper foil on a flexible polyimide film 3. The wiring circuit 4 is plated with tin 5 or its alloy on the side where gold bumps 2 are bonded, while the other side facing a bonding tool has no such plating.
Inventors:
KAWANOBE TORU
Application Number:
JP5353193A
Publication Date:
September 22, 1994
Filing Date:
March 15, 1993
Export Citation:
Assignee:
HITACHI LTD
HITACHI TOKYO ELECTRONICS
HITACHI TOKYO ELECTRONICS
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Yamato Tsutsui
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