Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3832102
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make it possible to maintain a heat radiation by relaxing a stress concentration generated in an adhesive layer attached to a heat sink through an adhesive layer and high reliable durability of a semiconductor chip.
SOLUTION: A semiconductor chip 14 is adhered on a heat sink plate 10 comprising copper material through a two-layered adhesive layer 12 of total 80 μm thickness, comprising a thermoplastic film adhesive layer 12a of 50 μm thickness and a paste series adhesive layer 12b of 30 μm thickness. A material of polyolefin group adhesive resin reformed to butadiene rubber and mixed with alumina micro particles is used as the thermoplastic film adhesive layer 12a, and a material of epoxy group adhesive resin reformed to silicon rubber and mixed with silver powder is used as the paste adhesive series layer 12b.
Inventors:
Masahiko Yukawa
Application Number:
JP22620198A
Publication Date:
October 11, 2006
Filing Date:
August 10, 1998
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/52; H01L21/60; H01L23/40; H01L23/31; H01L23/36; H01L23/42; (IPC1-7): H01L21/60; H01L21/52; H01L23/40
Domestic Patent References:
| JP10046114A | ||||
| JP9321169A | ||||
| JP5335353A |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hironobu Isoyama
Hironobu Isoyama