RADIATION SENSITIVE RESIN COMPOSITION, MATERIAL FOR FORMING BUMP AND FOR FORMING WIRING AND DRY FILM RESIST

Title:

RADIATION SENSITIVE RESIN COMPOSITION, MATERIAL FOR FORMING BUMP AND FOR FORMING WIRING AND DRY FILM RESIST

Document Type and Number:

Japanese Patent JP3832099

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin compsn. suitable for use as a material for forming a bump and for forming wiring.
SOLUTION: The radiation sensitive resin compsn. contains (A) an alkali- soluble copolymer consisting of (a) constituent units derived from a radical polymerizable compd. having a carboxyl group, (b) constituent units derived from a radical polymerizable compd. having a phenolic hydroxyl group and (c) constituent units derived from other radical polymerizable compd., (B) a compd. having at least one ethylenically unsatd. double bond and (C) a radiation radical polymn. initiator.

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Inventors:

Hirokazu Hirose
Yoshino Dono
Toru Kimura
Shingo Itai
Toshiyuki Daejeon
Yokoyama Yasuaki
Hozumi Sato

Application Number:

JP20923598A

Publication Date:

October 11, 2006

Filing Date:

July 24, 1998

Export Citation:

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Assignee:

JSR CORPORATION

International Classes:

G03F7/004; G03F7/033; C08F2/44; C08F291/06; G03F7/027; H05K3/18; (IPC1-7): G03F7/027; C08F2/44; C08F291/06; G03F7/004; G03F7/033; H05K3/18

Domestic Patent References:

JP9054435A
JP6043638A
JP10161309A
JP8078318A
JP8029980A
JP5105715A
JP5197149A
JP9068801A
JP11288091A
JP11315107A
JP10148937A

Attorney, Agent or Firm:

Toshiaki Fukuzawa

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