PURPOSE: To form a joint of solder material in a resin sealed body while preventing insufficient joint, swelling of resin sealed body or cracking after reflow soldering work.

CONSTITUTION: A hybrid IC 36 comprises an inner board and a body 34 for resin sealing the entirety wherein a passive element 26 is connected electrically and mechanically to the inner board at a soldering part 27 in the resin sealed body 34. The outer lead 19b of the hybrid IC 36 is connected with a printed wiring board 60 at a reflow soldering part 63. An inner soldering part 27 is formed of a solder material having a melting point higher than that of solder material at the reflow soldering part 63. At the time of reflow soldering of the outer lead 19b to the printed wiring board 60, the high melting point soldering part 27 in the resin sealed body 34 is not fused and thereby the joint 27 is not open-circuited nor short-circuited. Furthermore, since the solder material is not fused in the resin sealed body, the resin sealed body 34 is not swollen nor cracked.