PURPOSE: To avoid deformations of internal leads and facilitate improving the manufacturing yield and the reliability of a semiconductor device by a method wherein the tip parts of the internal leads are linked and fixed by an insulating film provided so as to keep away from bonding areas.

CONSTITUTION: A semiconductor element 3 is mounted on the die pad 2 of a lead frame 1 and, at the same time, the semiconductor element 3 is connected to the internal leads 4 of the lead frame 1 by bonding wires 5 and housed in a sealing package 6. In a semiconductor device like this, an insulating film 7 which is fixed so as to keep away from the bonding areas of the tips of the internal leads 4 and links the respective internal leads 4 is provided. Some 4b of the internal leads 4 of the lead frame 1 extended close to the die pad 2 are extended closer to the die pad 2 with smaller lead widths than the other leads 4a to form widened parts (f) at the tips of the leads 4b.