PURPOSE: To perform a resin sealing process and a screening process simultaneously and facilitate simplifying manufacture of a semiconductor device by a method wherein an electric signal for performing screening is supplied from an electric signal generating part to a resin sealing part which seals a semiconductor element with resin through an electric signal interconnection part.

CONSTITUTION: A resin sealing part 1 which seals a semiconductor element 9 mounted on a lead frame 6 or the like and has a die 5 with electric signal terminals 8 connected to the semiconductor element 9 electrically and provided on the part of the die 5, an electric signal generating part 2 which applies an electric signal to the semiconductor element 9 for performing screening and an electric signal interconnection part 3 which connects the resin sealing part 1 to the electric signal generating part 2 electrically are provided. For instance, the resin sealing part 1 is composed of upper and lower dies 4 and 5 and cavities 7 corresponding to the package shape of the semiconductor device 9 are formed in the respective dies 4 and 5. A plurality of the electric signal terminals 8 are provided on the parting plane of the one die 5 and they are connected to the electric signal generating part 2 through the electric signal interconnection part 3.