Title:
SEMICONDUCTOR DEVICE AND METHOD OF CUTTING FUSE ELEMENT IN THE DEVICE
Document Type and Number:
Japanese Patent JP2006286723
Kind Code:
A
Abstract:
To provide a semiconductor device provided with an electric fuse element capable of being cut with low power.
In the semiconductor device, the fuse element formed on the surface of a semiconductor substrate is cut with an electric pulse. The device is provided with a pulse generating circuit for generating an electric pulse having optional electric energy and repeatedly applying the pulse to the fuse element with an optional interval.
Inventors:
OMURA MASAYOSHI
Application Number:
JP2005101481A
Publication Date:
October 19, 2006
Filing Date:
March 31, 2005
Export Citation:
Assignee:
YAMAHA CORP
International Classes:
H01L21/82; H01L21/822; H01L21/8234; H01L27/04; H01L27/06
Domestic Patent References:
| JPH06302699A | 1994-10-28 | |||
| JPS63278250A | 1988-11-15 | |||
| JP2003109393A | 2003-04-11 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe
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