Title:
SEMICONDUCTOR INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JP2006286721
Kind Code:
A
Abstract:
To accurately conduct a trimming test of a temperature sensor before product shipment.
The semiconductor integrated circuit is applied to a system which uses a first supply voltage HV and a second supply voltage LV independent from the first one. It comprises a first region 12 to be supplied with the first supply voltage HV, the temperature sensor 18 arranged within the first region 12, and a first input path A1 which is arranged within the first region 12 and supplies a trimming signal for determining the detail of temperature control of the temperature sensor 18 to the temperature sensor 18.
Inventors:
URAKAWA YUKIHIRO
INUKAI TAKASHI
INUKAI TAKASHI
Application Number:
JP2005101446A
Publication Date:
October 19, 2006
Filing Date:
March 31, 2005
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/822; G01K7/01; G01K15/00; H01L27/04
Domestic Patent References:
| JPH04102080A | 1992-04-03 | |||
| JP2000338193A | 2000-12-08 | |||
| JPS4819157A | ||||
| JPH0764956A | 1995-03-10 | |||
| JP2004048518A | 2004-02-12 |
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
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