Title:
SEMICONDUCTOR DEVICE AND METHOD OF JUDGING MOUNTING
Document Type and Number:
Japanese Patent JP2001210681
Kind Code:
A
Abstract:
To provide a semiconductor device and a method of judging mounting with which mounting state of a BGA semiconductor device can be easily inspected.
The semiconductor device, of an electrical component 100 having BAG terminals has a plurality of terminals 101a, 101b, 101c, 101d for inspection, which are connected to a common circuit inside the semiconductor device and are arranged at least in a corner of a peripheral part in a rectangular annular shape. The method of judging mounting state is to inspect the mounting state by inspecting mutual electrical continuity among wiring patterns 201a, 201b, 201c, 201d for inspection after the electrical component 100 is connected to a printed board 200.
Inventors:
YAGI SHIGEKI
SUGITANI TOSHIYUKI
SUGITANI TOSHIYUKI
Application Number:
JP2000019821A
Publication Date:
August 03, 2001
Filing Date:
January 28, 2000
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/34; H01L21/60; (IPC1-7): H01L21/60; H05K3/34
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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