Title:
SEMICONDUCTOR DEVICE PACKAGE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2006295074
Kind Code:
A
Abstract:
To provide a semiconductor device package manufacturing method which can perform resistance-welding with a heat sink of single structure as a joining material.
The semiconductor device package manufacturing method includes a process to join a heat sink 6 to a base 1 formed of a thin metal sheet. The heat sink 6 is formed of a metal of the electric conductivity and heat conductivity higher than those of the base 1, and the method has a joining process which sandwiches the base 1 and heat sink 6 using a pair of welding electrodes 8a, 8b, and presses them while turning on the electric current through them in a state that the heat sink 6 is mounted on one side of the base 1.
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Inventors:
KAWABATA NORIAKI
Application Number:
JP2005117336A
Publication Date:
October 26, 2006
Filing Date:
April 14, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/12
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners