Title:
SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE OF THE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3491576
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a semiconductor element mounted by a TAB system from being broken by thermal stress due to contact of the element with a packaging board, when a semiconductor device itself is mounted on the packaging board along with a heat sink.
SOLUTION: An elastic insulating resin 7 is provided on the surface region of a semiconductor element 5. Accordingly, even if impact is applied to the surface of the element 5 when a semiconductor device itself is mounted on a packaging board turning the surface of the element 5 to the side of the packaging board, the impact is absorbed by the resin 7, can be relaxed and reliability can be obtained. In particular, in the case where the device itself is mounted on the packaging board turning the surface of the element 5 to the side of the packaging board and a heat sink is provided on the side of the bottom of the device, the device causes deflection, the surface of the element 5 abuts on the packaging board and the impact can be applied to the surface of the element 5, but the impact can be absorbed by the resin 7, relaxed, and reliability can be obtained.
Inventors:
Shunichi Yamamoto
Tetsumasa Maruo
Tetsumasa Maruo
Application Number:
JP29777599A
Publication Date:
January 26, 2004
Filing Date:
October 20, 1999
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L23/40; H01L21/60; H01L23/29; H01L23/31; (IPC1-7): H01L21/60; H01L23/29; H01L23/31; H01L23/40
Domestic Patent References:
| JP8236584A | ||||
| JP200067200A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)