Title:
SEMICONDUCTOR DEVICE AND STIFFENER
Document Type and Number:
Japanese Patent JP3275874
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with a stiffener effectively using metal plates without wasting while obtaining enough strength.
SOLUTION: A stiffener 3 is formed in a manner where four rectangular stiffener pieces 3A to 3D of the same shape are assembled into a square with a square space where an IC chip is mounted. Furthermore, the square-shaped stiffener 3 is arranged on a pressure sensitive adhesive double-side coated sheet 2. A space surrounded by these four stiffener pieces 3A to 3D is made to serve as an IC chip mounting hole 8A. The rectangular stiffener pieces 3A to 3D are combined into a square shape, so that a stiffener can be formed of a small number of metal plates.
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Inventors:
Hiroshi Koizumi
Application Number:
JP9062099A
Publication Date:
April 22, 2002
Filing Date:
March 31, 1999
Export Citation:
Assignee:
NEC
International Classes:
H01L23/12; H01L21/60; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Mitsuru Kimura
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