To prevent contamination on an adherend by an out gas and the damage to a package at the time of reflow resulting from moisture absorbed by the resin by insulating and bonding an inner lead and a semiconductor chip by using a fluorine-containing polymer as an adhesive film.

An insulating heat-resistant resin film such as polyimide, polyether amide, polyether amide imide, polyether sulfone, polyether ethyl ketone, polycarbonate, etc., is cited as the adhesive film. It is preferable that the thickness of the film is 5-200 μm, and it is further preferable that it is 25-50 μm. There is a tendency that workability is deteriorated at a time when adhesives are applied in the thickness less than 5 μm of the film. There is a tendency that the thickness of the semiconductor device is diffucult to be thinned in the thickness exceeding 200 μm of the film. The adhesive film can be used as the adhesive film having three-layer structure by forming adhesive layers on both surfaces of a base material.