Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2005203439
Kind Code:
A
Abstract:
To provide a semiconductor device which prevents a chip from breaking or cracking and voids from mixing between the chip and a die pad or remaining in the gap.
The semiconductor device comprises a chip 2 having a thickness of 50 μm or less, a larger die pad 1 than the chip 2 in a plan view, and a die bond film 11 having approximately the same size as the chip 2 in a plan view. This film 11 is held between a main surface of the chip 2 and that of the die pad 1 so as to conform with the outline of the chip 2 and has a thickness over 0.5 times the thickness of the chip 2.
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Inventors:
AKA FUMIAKI
Application Number:
JP2004005718A
Publication Date:
July 28, 2005
Filing Date:
January 13, 2004
Export Citation:
Assignee:
RENESAS TECH CORP
International Classes:
H01L21/52; H01L23/31; H01L23/29; (IPC1-7): H01L21/52; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai