Title:
半導体装置、半導体装置の製造方法、電気光学装置、及び電子機器
Document Type and Number:
Japanese Patent JP6500443
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device, a semiconductor device manufacturing method, an electrooptic device and an electronic apparatus, which can improve reliability.SOLUTION: A semiconductor device 50 comprises: a semiconductor element such as a transistor provided on a first substrate 31; a packaging terminal 32 electrically connected with the semiconductor element and an inspection terminal 33 electrically connected with the semiconductor element. Quality of a material of the packaging terminal 32 surface and quality of a material of the inspection terminal 33 are different from each other.SELECTED DRAWING: Figure 3
Inventors:
Toshiyuki Kasai
Murata Kenshi
Murata Kenshi
Application Number:
JP2015000675A
Publication Date:
April 17, 2019
Filing Date:
January 06, 2015
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L21/822; G02F1/1345; G09F9/30; H01L27/04; H01L51/50; H05B33/06; H05B33/10; H05B33/12; H05B33/22
Domestic Patent References:
| JP2001118994A | ||||
| JP2001210642A | ||||
| JP2000230964A | ||||
| JP58044734A | ||||
| JP2009170763A |
Foreign References:
| US20130077272 |
Attorney, Agent or Firm:
Kazuaki Watanabe
Mitsuhiro Isobe
Satoshi Nakai
Hiroki Matsuoka
Mitsuhiro Isobe
Satoshi Nakai
Hiroki Matsuoka