半導体装置及びその検査方法

Title:

半導体装置及びその検査方法

Document Type and Number:

Japanese Patent JP4300795

Kind Code:

B2

Inventors:

Hattori Tsukasa
Tetsuya Ueda

Application Number:

JP2002372246A

Publication Date:

July 22, 2009

Filing Date:

December 24, 2002

Export Citation:

Assignee:

Panasonic Corporation

International Classes:

B24B49/02; H01L21/3205; B24B37/013; H01L21/304; H01L21/321; H01L21/66; H01L21/768; H01L23/52; H01L23/522

Domestic Patent References:

JP2001308093A

Attorney, Agent or Firm:

Fumio Iwahashi
Hiroki Naito
Daisuke Nagano

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