Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP3567228
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To control the sneaking of resin to the backside of a tape carrier sealing resin and to realize slim TCP(tape carrier package). SOLUTION: A device is constituted of a tape carrier 2 which is provided with backside 2c that are overlapped and arranged with the outer peripheral part of a main face 1b of a semiconductor chip 1 and is provided with auxiliary opening parts 2e promoting the infiltrating of sealing resin at the time of sealing resin and of a resin sealing part 6 which resin-seals a joint part 4 of the electrode of the semiconductor chip 1 and the lead 2a of the tape carrier 2 and the peripheral part 5. Each auxiliary opening part 2e is provided for both end parts of a long device hole 2d where the leads 2a of the tape carrier 2 are arranged. Thus, the sneaking of resin from the main face 2b of the tape carrier 2 to a backside 2c in sealing resin is promoted.
Inventors:
Kazuhiro Okamura
Seiichi Ichihara
Hiroyuki Mouri
Koji Akimoto
Makoto Kimura
Seiichi Ichihara
Hiroyuki Mouri
Koji Akimoto
Makoto Kimura
Application Number:
JP10998297A
Publication Date:
September 22, 2004
Filing Date:
April 28, 1997
Export Citation:
Assignee:
Renesas Technology Corp.
Hitachi Super LSI Systems Co., Ltd.
Hitachi Super LSI Systems Co., Ltd.
International Classes:
H01L21/60; H01L21/56; (IPC1-7): H01L21/60; H01L21/56
Domestic Patent References:
| JP9199547A | ||||
| JP4000742U | ||||
| JP4023443A | ||||
| JP4034958A |
Attorney, Agent or Firm:
Yamato Tsutsui