Title:
半導体装置および電力変換装置
Document Type and Number:
Japanese Patent JP7452233
Kind Code:
B2
Abstract:
A semiconductor device includes a semiconductor element, a first wiring member, a second wiring member, and a terminal. The semiconductor element includes a first main electrode and a second main electrode on a side opposite from the first main electrode. The first wiring member is connected to the first main electrode. The terminal has a first terminal surface connected to the second main electrode and a second terminal surface. The second terminal has four sides. Two of the four sides are parallel to a first direction intersecting the thickness direction, and other two sides of the four sides are parallel to a second direction perpendicular to the thickness direction and the first direction. The second wiring member is connected to the second terminal surface of the terminal through solder, and has a groove. The groove overlaps one or two of the four sides of the second terminal surface.
Inventors:
Daisuke Fukuoka
Hideyuki Kamito
Masayoshi Umezawa
Masanori Ohshima
Ryoji Kamitaki
Takahiro Hirano
Hideyuki Kamito
Masayoshi Umezawa
Masanori Ohshima
Ryoji Kamitaki
Takahiro Hirano
Application Number:
JP2020081437A
Publication Date:
March 19, 2024
Filing Date:
May 01, 2020
Export Citation:
Assignee:
株式会社デンソー
トヨタ自動車株式会社
トヨタ自動車株式会社
International Classes:
H01L23/48; H01L23/40; H01L25/07; H01L25/18
Domestic Patent References:
| JP2020031129A | ||||
| JP2019176058A | ||||
| JP2015053343A |
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo