To provide a semiconductor IC contact structure suitable for testing a high frequency characteristic because of its signal path shorter than that in a conventional one, manufacturable at a low cost, capable of always keeping a good contact condition with a solder ball, and sufficiently applicable to a fine-pitch solder ball.

In this structure electrically connecting the solder ball 2 serving as a connection electrode of the semiconductor IC 1 to a land pattern 4 formed on an inspection circuit base board 3, contacts 5 each formed of a ring spring are arranged in correspondence to the respective solder balls 2. The ring spring is formed of wires sequentially connected to each other while bypassing a plurality of parts on the land pattern 4 so that the bypassing parts are raised slantingly from the land pattern 4. The solder balls 2 are forcibly pressed to the contacts 5.