PURPOSE: To make possible the improvement of reliability of the assembly of a multipin LSI and the improvement of the yield of the LSI by a method wherein the LSI is provided with bonding pad parts and pads for wafer probing test use, which are connected to the bonding pad parts.

CONSTITUTION: Bonding pads B1 to Bn are provided on the inside of a scribing line C and pads A1 to An for wafer probing test use are provided on the outside of the line C. The pads, which respectively make a pair among the pads B1 to Bn and the pads A1 to An, are connected to each other via a metallized wiring. When an electrical selection is performed on a wafer, probes are brought into contact to the pads A1 to An and a decision on the good or bad of the pads A1 to An is executed. Thereby, the reliability of the assembly of a multipin LSI and the yield of the LSI can be improved.