Title:
SEMICONDUCTOR LASER DRIVE DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR LASER DRIVE DEVICE
Document Type and Number:
Japanese Patent JP2021057440
Kind Code:
A
Abstract:
To reduce the wiring inductance at the time of electrical connection between a semiconductor laser and a laser driver in a semiconductor laser drive device.SOLUTION: A semiconductor laser drive device includes a substrate, a laser driver, and a semiconductor laser. The substrate includes a laser driver. The semiconductor laser is mounted on one surface of the substrate. A connection wiring connects the laser driver and the semiconductor laser electrically with wiring inductance of 0.5 nano-henry or less. A shield suppresses the flow of electromagnetic waves to and from the outside of a semiconductor laser drive for at least one of the semiconductor laser and the laser driver.SELECTED DRAWING: Figure 5
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Inventors:
NAGAO MASAYUKI
YASUKAWA HIRONAGA
YASUKAWA HIRONAGA
Application Number:
JP2019178634A
Publication Date:
April 08, 2021
Filing Date:
September 30, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP
International Classes:
H01S5/022; H01S5/042; H05K9/00
Attorney, Agent or Firm:
Toshikazu Marushima