Title:
SEMICONDUCTOR LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JPH01130576
Kind Code:
A
Abstract:
PURPOSE:To improve coupling efficiency with an optical fiber, and enable inspecting characteristics of each element in a wafer state, by forming the vicinity of light emitting point of a light emitting end surface into a semicolumar type, and arranging the light emitting point in the rear of chip end surface. CONSTITUTION:A light emitting end surface 13 formed into a columnar type has lens effect. Light output outward after refracted by said surface is bent in an active layer axis direction, and a light beam 12 has a beam spot whose light density is highest in the front of the light emitting end surface 13. By arranging an optical fiber 16 at the spot position, the light can be transmitted into the optical fiber 16 with high coupling efficiency. In a wafer state, each end surface light emitting diode chip exposes the light emitting end surface 13, and is electrically isolated, so that the chip can be driven by injecting a current from outside, and characteristics of each chip can be inspected in a wafer state.
Inventors:
YOSHIDA KAZUTOMI
Application Number:
JP29132087A
Publication Date:
May 23, 1989
Filing Date:
November 17, 1987
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L33/20; H01L33/30; (IPC1-7): H01L33/00
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)