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Title:
SEMICONDUCTOR LIGHT-RECEIVING ELEMENT, SEMICONDUCTOR LIGHT RECEIVING DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2002289906
Kind Code:
A
Abstract:

To manufacture an optical module or an optical transmitter which is superhigh in speed and has high sensitivity by scaling down of the size of an element for the reduction of an element capacity C of a board incidence type of semiconductor light-receiving element.

A plurality of ohmic connections 10 having their dimensions specified and a reflector 12, where being in contact with a semiconductor, a transparent film and a metal film 11 are stacked in this order are mixed within the diameter of light reception on a substrate that the incident light reaches after permeating the semiconductor, besides being located on the opposite side from the light incidence side of the board incidence type of semiconductor light-receiving element. Consequently, the optical module, the semiconductor light receiving device, and the optical transmitter, which are superhigh in speed and has high sensitivity corresponding to the enlargement of the transmission capacity can be manufactured with high reproductivity.


Inventors:
TERANO AKIHISA
MATSUOKA YASUNOBU
TANAKA SHIGEHISA
Application Number:
JP2001084307A
Publication Date:
October 04, 2002
Filing Date:
March 23, 2001
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
G02B6/42; H01L27/14; H01L27/144; H01L31/00; H01L31/0224; H01L31/0232; H01L31/0352; H01L31/075; H01L31/10; H01L31/105; H01L31/117; H01L31/12; (IPC1-7): H01L31/10; G02B6/42; H01L27/14; H01L31/0232; H01L31/12
Attorney, Agent or Firm:
Katsuo Ogawa (2 outside)